Other Scrap Metals Newsgroup

Location: USA, EXPORT TO CHINA ONLY GEORGIA

Solar grade polysilicon.
A. Solar grade polysilicon Technical requirements: 1. Si Purity: 99.9999% 2. Boron<0.20 ppba 3. Donor<0.90 ppba 4. Carbon<1.00ppba 5. Total bulk metals<30.00ppba 6. Total surface metals<30.00ppba 7. Size:25mm¡ª250mm 8. Poly Type:P-type 9. Resistivity>0.50ohmcm B. Semi grade scrap silicon chip Technical requirements: 1. Semi grade scrap silicon chips 2. Chips should be in ark 3. The thickness of the chip is not less than 400 um 4. Type:P-type 5. Resistivity>0.50ohmcm C. Polysilicon in small pieces Technical requirements: 1.N-type ,Resistivity>50ohmcm,Carbon<5*1016 /cm3 ,Oxygen<5*1017/cm3 2.Size=4mm 3.Oxidized layers and infusible materials should not be found, best to be clean D. CZ POLY Technical requirements: 1. Donor:N-type,Resistivity>100ohmcm Boron:P-type,Resistivity>1000ohmcm Life time of a few carriors >100us Carbon<1016 /cm3 Oxygen<1017/cm3 2. Chunk size>30mm 3. Oxidized layers and infusible materials should not exist, best to be clean materials E. Zonerefined top-and-tail silicon Technical requirements: 1.N-type, Resistivity>50ohmcm, Life time of a few carriors >100us 2.Chunk size>30mm 3.Air holes should not be included,no contamination by the contact with the wire loop and moreover no drift silicon and infusible materials be left in the process of zonerefining F. IC material(CZ silicon tops-and-tails), best to be clean 1. N-type, Resistivity>10ohmcm 2. P-type, Resistivity>0.5ohmcm 3. Chunk size>30mm,chip thickness>0.5mm 4. No air holes and moreover no infusible materials should be found